Packaging arrangement for energy dissipating devices

Details Packaging arrangement for energy dissipating devices Packaging arrangement for energy dissipating devices

1987-01-20

1989-05-09

Pellinen, A. D.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

29841, 174 522, 357 81, H05K 720

Patent

active

048294039

ABSTRACT:
A packaging arrangement for energy dissipating devices includes thermal elements adjacent first and second sides of the device, and a heat-flow modifier adjacent one of the thermal elements for regulating the flow of heat therefrom. A plurality of electrically conductive leads extend from the device to the exterior of the packaging arrangement. Portions of the electrically conductive leads extend between the thermal elements and are in thermal contact with at least one of the these elements. The leads are electrically isolated from the thermal elements and a seal is maintained between the leads and the elements. An outer casing surrounds the thermal elements, and the plurality of leads extend through the outer casing to provide for connecting the device to the environment. A seal is also maintained between the outer casing and the leads. The outer casing is preferably formed from premolded thermoplastic base and cap sections. The thermal elements and heat-flow modifiers are preferably integrally formed with the base and cap by injection molding techniques. After mounting the device in the base and connecting, isolating and sealing the leads, the base and cap are joined by fusion bonding of the thermoplastic using techniques such as induction heating or injection molding.

REFERENCES:
patent: 3585455 (1971-06-01), Naylor
patent: 4004195 (1977-06-01), Harayda et al.
patent: 4235285 (1980-11-01), Johnson et al.
patent: 4524238 (1985-06-01), Butt
patent: 4618739 (1986-10-01), Theobald
patent: 4621304 (1986-11-01), Oogaki et al.
patent: 4629824 (1986-12-01), Gilder, Jr. et al.
patent: 4692561 (1987-09-01), Nattel
patent: 4701999 (1987-10-01), Palmer
patent: 4715115 (1987-12-01), King et al.

Affiliated with

Also associated with

Rating

Packaging arrangement for energy dissipating devices does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Packaging arrangement for energy dissipating devices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Packaging arrangement for energy dissipating devices will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-93725