Packaging apparatus for optical-electronic semiconductors

Details Packaging apparatus for optical-electronic semiconductors Packaging apparatus for optical-electronic semiconductors

2008-06-02

2010-10-19

Weiss, Howard (Department: 2814)

Plastic and nonmetallic article shaping or treating: processes

Mechanical shaping or molding to form or reform shaped article

To produce composite, plural part or multilayered article

C257S712000, C257S687000

Reexamination Certificate

active

07815836

ABSTRACT:
A packaging apparatus for optical-semiconductors includes a mold base having a longitudinal receiving space, an encapsulating module attached to the mold base, and a fixing member attached to the encapsulating module. The bottom of the mold base has at least one air-vent and the mold base has a predetermined width. The encapsulating module includes a plate engaged with the mold base, a plurality of molding bodies penetrating the plate and received in the receiving space, and a plurality of supporting members connected to the molding bodies. The fixing member has a plurality of holding slots to hold the supporting members so that the supporting members are more stable. Furthermore, the width of the mold base is optimized with the dimension of a furnace so that the production rate is increased and the stability of the packaging structure is improved.

REFERENCES:
patent: 6652795 (2003-11-01), Konishi et al.
patent: 2005/0150624 (2005-07-01), Toh et al.

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