Packaging and passive alignment of microlens and molded...

Details Packaging and passive alignment of microlens and molded... Packaging and passive alignment of microlens and molded...

2006-02-14

2006-02-14

Vannucci, James (Department: 2828)

Coherent light generators

Particular resonant cavity

Mirror support or alignment structure

C385S031000, C385S049000

Reexamination Certificate

active

06999494

ABSTRACT:
A planar wafer-level packaging method is provided for a laser and a microlens. Light from the laser is directed and shaped by the microlens to couple into an external light guide. A plurality of such assemblies, each comprising a laser and a microlens may be assembled on a single planar substrate. A tapered surface is formed on the microlens. The microlens may be formed from a silicon substrate. The angle of the tapered surface causes an accurate cone or pyramid shape. The tapered surface is formed such that the axis of the cone or pyramid is aligned with the optical axis of the lens. The lens may then be aligned with the optical axis of the laser. A light guide receptacle is formed with a tapered surface that matches the tapered surface of the microlens. The tapered surface of the receptacle is formed such that the axis of the cone or pyramid is aligned with the optical axis of the receptacle. The receptacle may then be passively aligned with the microlens by mating the tapered surfaces.

REFERENCES:
patent: 5024966 (1991-06-01), Dietrich et al.
patent: 5349590 (1994-09-01), Amirkhanian et al.
patent: 6452726 (2002-09-01), Mandella
patent: 6741777 (2004-05-01), Jewell et al.
patent: 6801693 (2004-10-01), Jacobowitz et al.

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