Packaging and manufacturing of an integrated circuit

Details Packaging and manufacturing of an integrated circuit Packaging and manufacturing of an integrated circuit

2007-09-25

2007-09-25

Nhu, David (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Conductivity modulation device

C257S213000, C257S288000, C257S183000, C257SE21008, C257S051000, C257S499000

Reexamination Certificate

active

10976750

ABSTRACT:
Apparatus, packaging, and methods of manufacture of an integrated circuit are provided. The integrated circuit includes a component of a first type fabricated on a first substrate containing a first material, and a component of a second type fabricated on a second substrate containing a second material. The first material has better compatibility than the second material with fabrication and/or performance of the component of the first type, while the second material has better compatibility than the first material with fabrication and/or performance of the component of the second type. Also described, is a method of making the above-mentioned integrated circuit, the method including, among other steps, the step of disposing the first and second substrates opposite one another, and the step of establishing an electrical connection between the components.

REFERENCES:
patent: 4631400 (1986-12-01), Tanner et al.
patent: 4959900 (1990-10-01), De Givry et al.
patent: 5682064 (1997-10-01), Atkins et al.
patent: 5778523 (1998-07-01), Sylvester
patent: 6090687 (2000-07-01), Merchant et al.
patent: 6118181 (2000-09-01), Merchant et al.
patent: 6258626 (2001-07-01), Wang et al.
patent: 6462620 (2002-10-01), Dupuis et al.
patent: 6693698 (2004-02-01), Marshall et al.
patent: 2006/0012021 (2006-01-01), Larson et al.
Search report from corresponding U.S. Appl. No. PCT/US05/34824 dated Feb. 14, 2006.

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