Packaging and interconnection of contact structure

Details Packaging and interconnection of contact structure Packaging and interconnection of contact structure

2007-10-02

2007-10-02

Karlsen, Ernest (Department: 2858)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S762010, C257S692000, C257S696000

Reexamination Certificate

active

09929532

ABSTRACT:
A packaging and interconnection for connecting a contact structure to an outer peripheral component. The packaging and interconnection includes a contact structure made of conductive material and formed on a contact substrate, a contact trace formed on the contact substrate and connected to the contact structure, a contact pad formed on a bottom surface of the contact substrate and connected to the contact structure through a via hole and the contact trace, a contact target provided at an outer periphery of the contact structure to be electrically connected with the contact pad, and a conductive member for connecting the contact pad and the contact target.

REFERENCES:
patent: 3911361 (1975-10-01), Bove et al.
patent: 5772451 (1998-06-01), Dozier, II et al.
patent: 6023103 (2000-02-01), Chang et al.
patent: 6031282 (2000-02-01), Jones et al.
patent: 6184576 (2001-02-01), Jones et al.

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