Packaging and cooling structure for the personal processor modul

Details Packaging and cooling structure for the personal processor modul Packaging and cooling structure for the personal processor modul

1994-09-09

1996-08-27

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361686, 361699, 361700, H05K 714, G06F 1300

Patent

active

055507107

ABSTRACT:
A housing and cooling structure for a personal processor module (PPM) is provided which includes a case which is sealed and will fit within both a desktop sized docking station and a smaller notebook sized docking station. Within the case, the components which make up the PPM are located in such a way as to minimize the size of the printed circuit boards. In addition, a cooling mechanism is provided which cools all of the components within the case. Also, the PPM has structure for converting 3.3 volt signals into 5 volt signals and for permitting easy upgrades.

REFERENCES:
patent: 4137563 (1979-01-01), Tsunada
patent: 5187645 (1993-02-01), Spalding et al.
patent: 5264992 (1993-11-01), Hogdahl et al.
patent: 5278730 (1994-01-01), Kikinis

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