Packages for stacked integrated circuit chip cubes

Details Packages for stacked integrated circuit chip cubes Packages for stacked integrated circuit chip cubes

1992-06-24

1994-08-30

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

257685, 257686, 257723, 361735, 361744, 361749, 361807, 361809, H01R 2368

Patent

active

053433661

ABSTRACT:
This invention relates to three dimensional packaging of integrated circuit chips into stacks to form cuboid structures. Between adjacent chips in the stack, there is disposed an electrical interconnection means which is a first substrate having a plurality of conductors one end of which is electrically connected to chip contact locations and the other end of which extends to one side of the chip stack to form a plurality of pin-like electrical interconnection assemblies. The pin-like structures can be formed from projections of the first substrate having an electrical conductor on at least one side thereof extending from this side. Alternatively, the pin-like structures can be formed from conductors which cantilever from both sides of an edge of the first substrate and within which corresponding conductors from both sides are aligned and spaced apart by the first substrate thickness. The spaces contain solder and form solder loaded pin-like structures. The pin-like structures can be directly solder bonded to conductors on a second substrate surface or the pin-like structures can be adapted for insertion into apertures in a second substrate. The second substrate provides a means for electrically inter-connecting a plurality of these cuboids. Preferably, the first and second substrates are circuitized flexible polymeric films. The second substrate is disposed on a third substrate, such as a PC board, with a resilient material therebetween which permits a heat sink to be pressed into intimate contact with an opposite side of the cuboid structures.

REFERENCES:
patent: 2568242 (1951-09-01), Matteson, Jr.
patent: 2602413 (1952-07-01), Miller
patent: 3113248 (1963-12-01), Friedman
patent: 3152288 (1964-10-01), Mittler
patent: 3316455 (1967-04-01), Hucke, III
patent: 3492538 (1970-01-01), Fergusson
patent: 3515949 (1970-06-01), Michaels et al.
patent: 3705332 (1972-12-01), Parks
patent: 3766439 (1973-10-01), Isaacson
patent: 4237522 (1980-12-01), Thompson
patent: 4396140 (1983-08-01), Jaffe et al.
patent: 4426689 (1984-01-01), Henle et al.
patent: 4517625 (1985-05-01), Frink et al.
patent: 4549200 (1985-10-01), Ecker et al.
patent: 4574331 (1986-03-01), Smolley
patent: 4658332 (1987-04-01), Baker et al.
patent: 4661887 (1987-04-01), Lin
patent: 4703984 (1987-11-01), Mitchell, Jr.
patent: 4755866 (1988-07-01), Marshall et al.
patent: 4764846 (1988-08-01), Go
patent: 4770640 (1988-09-01), Walter
patent: 4773868 (1988-09-01), Heinecke
patent: 4790894 (1988-12-01), Homma et al.
patent: 4830264 (1989-05-01), Bitaillou et al.
patent: 4868712 (1989-09-01), Woodman
patent: 4886461 (1989-12-01), Smith
patent: 4916575 (1990-04-01), Van Asten
patent: 4922376 (1990-05-01), Pommer et al.
patent: 4953058 (1990-08-01), Harris
patent: 4956694 (1990-09-01), Eide
patent: 4956746 (1990-09-01), Gates, Jr. et al.
patent: 4972298 (1990-11-01), Casa et al.
patent: 4983533 (1991-01-01), Go
patent: 5003429 (1991-03-01), Baker et al.
patent: 5031072 (1991-07-01), Malhi et al.
patent: 5037311 (1991-08-01), Frankeny et al.
patent: 5041903 (1991-08-01), Millerick et al.
patent: 5050039 (1991-09-01), Edfors

Affiliated with

Also associated with

Rating

Packages for stacked integrated circuit chip cubes does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Packages for stacked integrated circuit chip cubes, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Packages for stacked integrated circuit chip cubes will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-33870