Packages for microwave integrated circuits

Wave transmission lines and networks – Automatically controlled systems – With control of equalizer and/or delay network

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

357 68, 357 80, 357 81, 333247, H01L 2302, H01L 2312, H01L 3902

Patent

active

042596840

ABSTRACT:
This disclosure relates to the packaging of microwave integrated circuits (MICs) whereby an MIC is hermetically sealed within an enclosure comprising a first plate of dielectric material which carries the circuit to be enclosed, a wall of dielectric material sealed to the surface of the first plate surrounding the circuit, and a second plate of dielectric material providing a lid sealed over the wall to complete the enclosure. The first plate carries planar conductors which define at least one microwave transmission line, e.g. microstrip, extending across the wall into the enclosure from outside to provide direct microwave coupling to the enclosed circuit and thereby obviating the usual need for transitions to and from coaxial cable.
Part or all of the enclosed circuit may be contained within a recess provided by forming an aperture in the first plate and sealing a third plate of dielectric material across the aperture from below.
The disclosure describes various techniques for reducing losses where the transmission line propagation paths traverse the wall on the surface of the first plate. The entire package may be fabricated using materials and techniques compatible with those used in fabricating MIC's, for example thick film.

REFERENCES:
patent: 3479570 (1969-11-01), Gilbert
patent: 3611059 (1971-10-01), Carley
patent: 3715635 (1973-02-01), Michel et al.
patent: 3767979 (1973-10-01), Reber
patent: 3784883 (1974-01-01), Duncan et al.
patent: 3886505 (1975-05-01), Jacobson
patent: 3943469 (1976-03-01), Kawamoto et al.
patent: 3958195 (1976-05-01), Johnson

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Packages for microwave integrated circuits does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Packages for microwave integrated circuits, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Packages for microwave integrated circuits will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2246999

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.