Packaged surface acoustic wave filter chips utilizing an on-chip

Details Packaged surface acoustic wave filter chips utilizing an on-chip Packaged surface acoustic wave filter chips utilizing an on-chip

1998-09-15

2000-02-08

Pascal, Robert

Wave transmission lines and networks

Coupling networks

Electromechanical filter

333194, 310348, 310313B, H03H 964, H03H 910

Patent

active

060232048

ABSTRACT:
A surface acoustic wave device includes a plurality of surface acoustic wave filter chips having external connection terminals and a package accommodating the plural surface acoustic wave filter chips. The package is provided with a plurality of terminals for connection with the surface acoustic wave filter chips, and one of the external connection terminals of a first one of the surface acoustic wave filter chips is connected with one of the terminals of the package via a second one of the surface acoustic wave filter chips.

REFERENCES:
patent: 5438305 (1995-08-01), Hikita et al.
patent: 5604393 (1997-02-01), Suzuki et al.
patent: 5721519 (1998-02-01), Onishi et al.
patent: 5874869 (1999-02-01), Ueda et al.

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