Packaged semiconductor device having stacked die

Details Packaged semiconductor device having stacked die Packaged semiconductor device having stacked die

2005-03-01

2005-03-01

Smoot, Stephen W. (Department: 2813)

Semiconductor device manufacturing: process

Chemical etching

Vapor phase etching

C438S777000, C438S784000

Reexamination Certificate

active

06861366

ABSTRACT:
The present invention provides a packaged semiconductor device that includes two semiconductor die. The first semiconductor die is attached to a package substrate using adhesive. A first set of wire bonds electrically connect the first semiconductor die to the package substrate. A first layer of encapsulant extends over the first semiconductor die and over the first set of wire bonds. A second semiconductor die is attached to the first layer of encapsulant using adhesive. A second set of wire bonds electrically connect the second semiconductor die to the package substrate. A second layer of encapsulant extends over the second semiconductor die and over the second set of wire bonds.

REFERENCES:
patent: 6388313 (2002-05-01), Lee et al.
patent: 6555917 (2003-04-01), Heo
patent: 6683385 (2004-01-01), Tsai et al.
patent: 20030111716 (2003-06-01), Ano

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