Electricity: electrical systems and devices – Safety and protection of systems and devices – With specific current responsive fault sensor
Patent
1990-02-14
1991-04-09
James, Andrew J.
Electricity: electrical systems and devices
Safety and protection of systems and devices
With specific current responsive fault sensor
357 72, 357 79, 361400, H01L 2350, H01L 2304
Patent
active
050069225
ABSTRACT:
An improved packaged semiconductor device is provided having an electronic component, such as an integrated circuit, enclosed within a single layer ceramic PGA package. A cap, of substantially the same areal dimension as the base, is sealed to the base forming a cavity in which the integrated circuit is mounted. Input/output pins are attached to through-holes in the base and extend through the base and are exposed by holes in the cap aligned to the through-holes in the base. Extensive glass sealing of the cap to the base, made possible by the substantially co-extensive nature of the cap with respect to the base, provides a sturdy highly reliable seal making the packaged semiconductor device better able to withstand mechanical stress.
REFERENCES:
patent: 4338621 (1982-07-01), Braun
patent: 4630096 (1986-12-01), Drye et al.
patent: 4639631 (1987-01-01), Chason et al.
patent: 4692839 (1987-09-01), Lee et al.
patent: 4750092 (1988-06-01), Werther
patent: 4791075 (1988-12-01), Lin
patent: 4861944 (1989-08-01), Jones, II et al.
patent: 4897711 (1990-01-01), Blonder et al.
Ceramic Through-Hole Pinning; J. D. Larnerd et al., Proc. 35th IEEE, Electronic Components Conference, p. 465, 1985.
Low Cost Pin Grid Array Packages; C. H. Brown, Solid State Technol., 18(5), p. 239, May 1985.
A Unique Low Cost Pin Grid Array Package with Heat Spreader; M. McShane, P. Lin and H. Wilson, Proc. 39th Ann. Int. Elect. Pack. Conf., p. 199, Sep. 11, 1989.
Lin Paul T.
McShane Michael B.
Wilson Howard P.
Dockrey Jasper W.
James Andrew J.
Motorola Inc.
Nguyen Viet Q.
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