Packaged semiconductor device and semiconductor device packaging

Details Packaged semiconductor device and semiconductor device packaging Packaged semiconductor device and semiconductor device packaging

1991-02-04

1992-04-14

Wojciechowicz, Edward J.

Electricity: electrical systems and devices

Safety and protection of systems and devices

With specific current responsive fault sensor

357 68, 357 71, 357 72, 361421, H01L 2348, H05K 502

Patent

active

051052571

ABSTRACT:
A packaged semiconductor device includes trapezoidal power leads and an earth lead in a resin package. The power and earth leads have a large area, radiate heat, and reduce inductance, improving the electrical characteristics of the packaged semiconductor device.

REFERENCES:
patent: 4972253 (1990-11-01), Palino et al.

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