Packaged semiconductor device and method of manufacturing the sa

Details Packaged semiconductor device and method of manufacturing the sa Packaged semiconductor device and method of manufacturing the sa

1999-06-15

2000-10-10

Nelms, David

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

438106, H01L 2144

Patent

active

061301116

ABSTRACT:
A packaged semiconductor device includes an LSI chip, a chip size package integrally bonded to the LSI chip to mount and hold the LSI chip thereon in order to connect an electrode of a board on which the LSI chip is to be mounted and an electrode of the LSI chip to each other, an electrode formed on a surface of the package opposite to a surface thereof which is bonded to the LSI chip, so as to be connected to the electrode of the board, at least one through hole formed to extend through the LSI chip and the package, and a connecting conductor formed to extend through the through hole in order to connect the electrode of the package and the electrode of the LSI package to each other.

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