Packaged semiconductor device and method of manufacture...

Details Packaged semiconductor device and method of manufacture... Packaged semiconductor device and method of manufacture...

2008-06-24

2008-06-24

Luu, Chuong A. (Department: 2892)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S123000, C438S127000

Reexamination Certificate

active

07390698

ABSTRACT:
A semiconductor packaging technique provides for a semiconductor device with improved electrical and thermal performance. According to one embodiment of the invention, die edges are shaped before encapsulation to move the peripheral area of the die, which is more susceptible to stress and cracking, further inside the molding compound. This results in a device that can better withstand stress as well being more resistant to corrosion and other reliability problems caused by environmental conditions.

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U.S. Appl. No. 09/464,885, filed Dec. 16, 1999, Joshi et al.

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