Packaged semiconductor device

Details Packaged semiconductor device Packaged semiconductor device

1989-05-03

1991-01-08

Hille, Rolf

357 69, H01L 2348

Patent

active

049840622

ABSTRACT:
A packaged semiconductor device includes a resin package having a rectangular shape, a semiconductor device contained in the resin package and having a plurality of terminals oriented along the shorter sides of the resin package, a plurality of leads located in the vicinity of the terminals of the semiconductor device and extending outwardly from the shorter sides of the resin package generally parallel to the longer sides, and a plurality of lead wires respectively connecting each of the plurality of terminals of the semiconductor device to one of the plurality of leads.

REFERENCES:
patent: 4514750 (1985-04-01), Adams

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