Packaged microelectronic devices and methods for packaging...

Details Packaged microelectronic devices and methods for packaging... Packaged microelectronic devices and methods for packaging...

2008-02-08

2010-02-02

Luu, Chuong A. (Department: 2892)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S118000, C438S125000, C438S613000

Reexamination Certificate

active

07655500

ABSTRACT:
Packaged microelectronic devices and methods for packaging microelectronic devices are disclosed herein. In one embodiment, a method of packaging a microelectronic device including a microelectronic die having a first side with a plurality of bond-pads and a second side opposite the first side includes forming a recess in a substrate, placing the microelectronic die in the recess formed in the substrate with the second side facing toward the substrate, and covering the first side of the microelectronic die with a dielectric layer after placing the microelectronic die in the recess. The substrate can include a thermal conductive substrate, such as a substrate comprised of copper and/or aluminum. The substrate can have a coefficient of thermal expansion at least approximately equal to the coefficient of thermal expansion of the microelectronic die or a printed circuit board.

REFERENCES:
patent: 4903185 (1990-02-01), Fiorina et al.
patent: 4931853 (1990-06-01), Ohuchi et al.
patent: 5000821 (1991-03-01), Bostjancic
patent: 5008213 (1991-04-01), Kolesar, Jr.
patent: 5081563 (1992-01-01), Feng et al.
patent: 5400986 (1995-03-01), Amore et al.
patent: 5409865 (1995-04-01), Karnezos
patent: 5805184 (1998-09-01), Horiike et al.
patent: 5851845 (1998-12-01), Wood et al.
patent: 5903371 (1999-05-01), Arecco et al.
patent: 5904655 (1999-05-01), Brackett
patent: 5933713 (1999-08-01), Farnworth
patent: 5946553 (1999-08-01), Wood et al.
patent: 6000486 (1999-12-01), Romick et al.
patent: 6000807 (1999-12-01), Moreland
patent: 6002062 (1999-12-01), Michel et al.
patent: 6004867 (1999-12-01), Kim et al.
patent: 6007223 (1999-12-01), Futami et al.
patent: 6008070 (1999-12-01), Farnworth
patent: 6020624 (2000-02-01), Wood et al.
patent: 6072236 (2000-06-01), Akram et al.
patent: 6102463 (2000-08-01), Swanson et al.
patent: 6124634 (2000-09-01), Akram et al.
patent: 6184465 (2001-02-01), Corisis
patent: 6187615 (2001-02-01), Kim et al.
patent: 6225695 (2001-05-01), Chia et al.
patent: 6228687 (2001-05-01), Akram et al.
patent: 6235552 (2001-05-01), Kwon et al.
patent: 6271469 (2001-08-01), Ma et al.
patent: 6326697 (2001-12-01), Farnworth
patent: 6326698 (2001-12-01), Akram
patent: 6407381 (2002-06-01), Glenn et al.
patent: 6452255 (2002-09-01), Bayan et al.
patent: 6459163 (2002-10-01), Bai et al.
patent: 6503780 (2003-01-01), Glenn et al.
patent: 6537848 (2003-03-01), Camenforte et al.
patent: 6709898 (2004-03-01), Ma et al.
patent: 7312101 (2007-12-01), Jiang et al.
patent: 7329949 (2008-02-01), Jiang et al.
patent: 2003/0059976 (2003-03-01), Nathan et al.
patent: 2004/0135269 (2004-07-01), Otsuki
patent: 2004/0150101 (2004-08-01), Fraley et al.

Affiliated with

Also associated with

Rating

Packaged microelectronic devices and methods for packaging... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Packaged microelectronic devices and methods for packaging..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Packaged microelectronic devices and methods for packaging... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4182151