Packaged microelectronic devices and methods for...

Details Packaged microelectronic devices and methods for... Packaged microelectronic devices and methods for...

2011-06-07

2011-06-07

Ghyka, Alexander G (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

C438S118000, C438S127000, C257SE21505, C257SE23141

Reexamination Certificate

active

07955898

ABSTRACT:
Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices are disclosed. In one embodiment, a method for forming a microelectronic device includes attaching a microelectronic die to a support member by forming an attachment feature on at least one of a back side of the microelectronic die and the support member. The attachment feature includes a volume of solder material. The method also includes contacting the attachment feature with the other of the microelectronic die and the support member, and reflowing the solder material to join the back side of the die and the support member via the attachment feature. In several embodiments, the attachment feature is not electrically connected to internal active structures of the die.

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