Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2005-08-23
2005-08-23
Dang, Phuc T. (Department: 2818)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
C438S612000
Reexamination Certificate
active
06933170
ABSTRACT:
Various aspects of the present invention provide microelectronic component assemblies and methods for packaging such assemblies. In one example, a microelectronic component assembly includes a substrate and a microelectronic component. This substrate has a recess in its back face and a communication opening extending through a base of the recess. This microelectronic component has an active face positioned within the substrate recess, a back face positioned outside the substrate recess, and a plurality of component contacts carried by the component active face and electrically coupled to the substrate contacts through the communication opening. This exemplary microelectronic component assembly may also include a mold compound which encapsulates the microelectronic component and a portion of the substrate active face. The mold compound may also substantially fill a gap between the periphery of the microelectronic component and a sidewall of the recess.
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Dang Phuc T.
Micro)n Technology, Inc.
Perkins Coie LLP
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