Packaged electronic device

Details Packaged electronic device Packaged electronic device

1985-03-28

1987-01-27

Grimley, Arthur T.

Electricity: electrical systems and devices

Miscellaneous

174 685, 174 52PE, 361402, H05K 103

Patent

active

046398309

ABSTRACT:
An electronic device having a thick film interconnection substrate of a multilayer configuration having a major surface on which conductor patterns for mounting thereon IC chips or the like elements and wiring conductor patterns are formed. A noncrystallizing glass layer is deposited on the major surface with the chip mounting conductor patterns being exposed while the wiring conductor patterns are covered. A crystallizing glass layer is formed on the noncrystallizing glass layer. The IC chips or other elements as mounted are packaged in a hardening composition layer. A device exhibiting an improved moisture proofness and thus a high reliability is realized.

REFERENCES:
patent: 3317653 (1967-05-01), Layer, Jr. et al.
patent: 3909680 (1975-09-01), Tsunashima
patent: 4237606 (1980-12-01), Niwa et al.
patent: 4424251 (1984-01-01), Sugishita et al.
patent: 4490429 (1984-12-01), Tosaki et al.

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