Packaged electronic component and method of preparing the same

Electrical resistors – Incased – embedded – or housed – Casing or housing formed on and hardened on resistor

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

338221, 338324, 361417, H01C 1034

Patent

active

042504821

ABSTRACT:
A packaged electronic component includes an insulating body completely enclosing the electronic component except for runner-like blade leads which extend outwardly from the insulating body. The runner-like blade leads are more durable than conventional shaped leads and facilitate the making and breaking of sliding electrical contact with stationary contacts. A method of preparing the novel, packaged electronic component is also disclosed.

REFERENCES:
patent: 2587674 (1952-03-01), Aiken
patent: 2860222 (1958-11-01), Saltzman et al.
patent: 3405381 (1968-10-01), Zandman et al.
patent: 3781596 (1973-12-01), Galli et al.
patent: 3808506 (1974-04-01), Lang
patent: 3902148 (1975-08-01), Drees et al.
patent: 4065625 (1977-12-01), Iwai et al.
patent: 4138691 (1979-02-01), Bonkohara et al.
patent: 4152689 (1979-05-01), Thompson

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Packaged electronic component and method of preparing the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Packaged electronic component and method of preparing the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Packaged electronic component and method of preparing the same will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1667687

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.