Packaged device and method of forming same

Details Packaged device and method of forming same Packaged device and method of forming same

2007-02-20

2007-02-20

Lebentritt, Michael (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S113000, C438S127000

Reexamination Certificate

active

11191132

ABSTRACT:
A method of packaging an integrated circuit die includes the steps of loading an array of soft conductive balls into recesses formed in a platen and locating the platen in a first part of a mold cavity. A second part of the mold is pressed against the balls to flatten a surface of the balls. A first mold compound then is injected into the mold cavity such that the mold compound surrounds exposed portions of the balls. The balls are removed from the platen and a first side of an integrated circuit die is attached to the balls. Die bonding pads on a second side of the die are electrically connected to respective ones of the balls surrounding the die, and then the die, the electrical connections, and a top portion of the conductive balls is encapsulated with a second mold compound.

REFERENCES:
patent: 5695109 (1997-12-01), Chiang et al.
patent: 6148900 (2000-11-01), Yamasaki et al.
patent: 6215179 (2001-04-01), Ohgiyama
patent: 6551862 (2003-04-01), Oota et al.
patent: 6992380 (2006-01-01), Masumoto
patent: 7056766 (2006-06-01), Shiu et al.
patent: 2006/0234421 (2006-10-01), Lo et al.

Affiliated with

Also associated with

Rating

Packaged device and method of forming same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Packaged device and method of forming same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Packaged device and method of forming same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3841254