Packaged device adapter assembly with alignment structure...

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C439S070000, C439S526000

Reexamination Certificate

active

06877993

ABSTRACT:
A packaged device adapter assembly for use with high density integrated circuit packages, e.g., micro lead frame packages, micro lead chip carriers, quad flat no lead packages, and micro ball grid array packages, etc., includes an alignment structure for aligning a packaged device therein.

REFERENCES:
patent: 2578288 (1951-12-01), Cook
patent: 2951817 (1960-09-01), Myers
patent: 3229756 (1966-01-01), Keresztury
patent: 3728509 (1973-04-01), Shimojo
patent: 3760342 (1973-09-01), Prouty et al.
patent: 3870385 (1975-03-01), Avakian et al.
patent: 3971610 (1976-07-01), Buchoff et al.
patent: 4295699 (1981-10-01), DuRocher
patent: 4345810 (1982-08-01), Bakermans
patent: 4460223 (1984-07-01), Brown et al.
patent: 4514784 (1985-04-01), Williams et al.
patent: 4550959 (1985-11-01), Grabbe et al.
patent: 4655524 (1987-04-01), Etzel
patent: 4668957 (1987-05-01), Spohr
patent: 4678250 (1987-07-01), Romine et al.
patent: 4729166 (1988-03-01), Lee et al.
patent: 4754546 (1988-07-01), Lee et al.
patent: 4862076 (1989-08-01), Renner et al.
patent: 4923739 (1990-05-01), Jin et al.
patent: 5074799 (1991-12-01), Rowlette, Sr.
patent: 5109320 (1992-04-01), Bourdelaise et al.
patent: 5123849 (1992-06-01), Deak et al.
patent: 5127837 (1992-07-01), Shah et al.
patent: 5129833 (1992-07-01), Rowlette, Sr.
patent: 5137462 (1992-08-01), Casey et al.
patent: 5140405 (1992-08-01), King et al.
patent: 5155661 (1992-10-01), Nagesh et al.
patent: 5163837 (1992-11-01), Rowlette, Sr.
patent: 5286218 (1994-02-01), Sakurai et al.
patent: 5313099 (1994-05-01), Tata et al.
patent: 5318456 (1994-06-01), Mori
patent: 5340318 (1994-08-01), Kunihiro
patent: 5377900 (1995-01-01), Bergmann
patent: 5387861 (1995-02-01), Neiderhofer
patent: 5389819 (1995-02-01), Matsuoka
patent: 5397240 (1995-03-01), Herard
patent: 5397245 (1995-03-01), Roebuck et al.
patent: 5397919 (1995-03-01), Tata et al.
patent: 5418471 (1995-05-01), Kardos
patent: 5432679 (1995-07-01), Grabbe
patent: 5445526 (1995-08-01), Hoshino et al.
patent: 5468158 (1995-11-01), Roebuck et al.
patent: 5473510 (1995-12-01), Dozier, II
patent: 5477160 (1995-12-01), Love
patent: 5528462 (1996-06-01), Pendse
patent: 5548223 (1996-08-01), Cole et al.
patent: 5566052 (1996-10-01), Hughes
patent: 5636996 (1997-06-01), Johnson et al.
patent: 5662163 (1997-09-01), Mira
patent: 5667870 (1997-09-01), McCullough
patent: 5691041 (1997-11-01), Frankeny et al.
patent: 5699227 (1997-12-01), Kolman et al.
patent: 5710459 (1998-01-01), Teng et al.
patent: 5712768 (1998-01-01), Werther
patent: 5730620 (1998-03-01), Chan et al.
patent: 5735698 (1998-04-01), Bakker et al.
patent: 5741141 (1998-04-01), O'Malley
patent: 5742481 (1998-04-01), Murphy et al.
patent: 5745346 (1998-04-01), Ogawa et al.
patent: 5766022 (1998-06-01), Chapin et al.
patent: 5770891 (1998-06-01), Frankeny et al.
patent: 5783461 (1998-07-01), Hembree
patent: 5791914 (1998-08-01), Loranger et al.
patent: 5793618 (1998-08-01), Chan et al.
patent: 5805424 (1998-09-01), Purinton
patent: 5810607 (1998-09-01), Shih et al.
patent: 5819406 (1998-10-01), Yoshizawa et al.
patent: 5829988 (1998-11-01), McMillan et al.
patent: 5833471 (1998-11-01), Selna
patent: 5859538 (1999-01-01), Self
patent: 5876219 (1999-03-01), Taylor et al.
patent: 5877554 (1999-03-01), Murphy
patent: 5879172 (1999-03-01), McKenna-Olson et al.
patent: 5892245 (1999-04-01), Hilton
patent: 5893765 (1999-04-01), Farnworth
patent: 5896037 (1999-04-01), Kudla et al.
patent: 5923176 (1999-07-01), Porter et al.
patent: 5973618 (1999-10-01), Ellis
patent: 5982635 (1999-11-01), Menzies et al.
patent: 6007348 (1999-12-01), Murphy
patent: 6325280 (2001-12-01), Murphy
patent: 6351392 (2002-02-01), Palanpiappa et al.
patent: 6394820 (2002-05-01), Palaniappa et al.
patent: 6533589 (2003-03-01), Palaniappa et al.
patent: 6644981 (2003-11-01), Choy
patent: 0 905 826 (1999-03-01), None
patent: WO 9716849 (1997-05-01), None
patent: WO 9966599 (1999-12-01), None
Herard et al. “Interconnection Technology: Using dendrites to bridge the gaps”Printed Circuit Fabrication1995;18(9)22-24.
Jarvela R.A. “Module Holder and Actuator”Technical Disclosure Bulletin1974;16(12)3975-3976.
Lau, John H., ed. “A Brief Introduction to Ball Grid Array Technologies”Ball Grid Array Technology1995;pp. xiii-xvi;1-57.
Application Notes for Surface Mount Assembly of Amkor's Micro LeadFrame(MLF) Packages. Sep. 2002.
Ironwood Electronics, Inc. VLSI Interconnection Specialists Catalog XII (pp. 84, 110) (product on p. 110 available at least as early as Oct. 4, 1998).
Ironwood Electronics, Inc. VLI Interconnection Specialists Product Brochure, Spring 1998. 6 pages.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Packaged device adapter assembly with alignment structure... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Packaged device adapter assembly with alignment structure..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Packaged device adapter assembly with alignment structure... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3409873

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.