Packaged circuit module for improved installation and operation

Details Packaged circuit module for improved installation and operation Packaged circuit module for improved installation and operation

2006-11-03

2008-12-09

Hollington, Jermele M (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

Reexamination Certificate

active

07463048

ABSTRACT:
A packaged circuit module. In one embodiment, the packaged circuit module includes an X2Y device having first and second ground terminals, a positive terminal, and a negative terminal. The packaged circuit module also includes a first interface terminal, a second interface terminal, and a bracket. The first interface terminal electrically connects to the positive terminal of the X2Y device and to a first terminal of a motor. The second interface terminal electrically connects to the negative terminal of the X2Y device and to a second terminal of a motor. The bracket connects the first and second ground terminals of the X2Y device and to a grounding structure.

REFERENCES:
patent: 4322119 (1982-03-01), Baker
patent: 4511201 (1985-04-01), Baker et al.
patent: 4810956 (1989-03-01), Hvezda et al.
patent: 4812949 (1989-03-01), Fontan et al.
patent: 4826440 (1989-05-01), Plocek et al.
patent: 4875457 (1989-10-01), Fitzner
patent: 4949224 (1990-08-01), Yamamura et al.
patent: 5559445 (1996-09-01), Eaddy et al.
patent: 5802707 (1998-09-01), Brownell et al.
patent: 6043991 (2000-03-01), Sorrentino
patent: 6301111 (2001-10-01), Katsui
patent: 6305953 (2001-10-01), Shi et al.
patent: 6307344 (2001-10-01), Pajak et al.
patent: 6319026 (2001-11-01), Chen et al.
patent: 6328603 (2001-12-01), Chang
patent: 6347962 (2002-02-01), Kline
patent: 6349465 (2002-02-01), Brownell et al.
patent: 6445201 (2002-09-01), Simizu et al.
patent: 6474999 (2002-11-01), Givens et al.
patent: 6648657 (2003-11-01), Korsunsky et al.
patent: 6685486 (2004-02-01), Zhang et al.
patent: 6703702 (2004-03-01), Inoue et al.
patent: 6888062 (2005-05-01), Erickson et al.
patent: 7018240 (2006-03-01), Bourdykina et al.
patent: 7141899 (2006-11-01), Anthony et al.
patent: 7142001 (2006-11-01), Bhatti
patent: 7162388 (2007-01-01), Johannes et al.
patent: 2003/0132520 (2003-07-01), Watanabe et al.
patent: 2003/0159122 (2003-08-01), Iida et al.
patent: 2005/0239331 (2005-10-01), Bourdykina et al.
Presentation X2Y® Technology for connectors, Phicomp a Yageo Company; http://www.yageo.com/pdf/X2y%20In%20Connectors.Pdf; Mar. 18, 2003.

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