Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Reexamination Certificate
2006-11-28
2006-11-28
Hollington, Jermele (Department: 2829)
Electricity: measuring and testing
Fault detecting in electric circuits and of electric components
Of individual circuit component or element
Reexamination Certificate
active
07142001
ABSTRACT:
A module for a packaged circuit. In one embodiment, the module includes at least one ground terminal and at least one signal terminal; a circuit board configured to hold the packaged circuit where the circuit board has an interface terminal and one or more traces electrically connecting the at least one signal terminal of the packaged circuit to the interface terminal; and a conductive bracket having a first side, the first side configured to support the circuit board and having at least one clip, the clip configured to hold at least a portion of the circuit board and to contact the at least one ground terminal of the packaged circuit, the conductive bracket configured to provide at least some electromagnetic shielding for the packaged circuit from sources of electromagnetic energy located opposite the first side of the bracket.
REFERENCES:
patent: 4322119 (1982-03-01), Baker
patent: 4511201 (1985-04-01), Baker et al.
patent: 4810956 (1989-03-01), Hvezda et al.
patent: 4812949 (1989-03-01), Fontan et al.
patent: 4826440 (1989-05-01), Plocek et al.
patent: 4875457 (1989-10-01), Fitzner
patent: 4949224 (1990-08-01), Yamamura et al.
patent: 5559445 (1996-09-01), Eaddy et al.
patent: 5802707 (1998-09-01), Brownell et al.
patent: 6043991 (2000-03-01), Sorrentino
patent: 6301111 (2001-10-01), Katsui
patent: 6305953 (2001-10-01), Shi et al.
patent: 6307344 (2001-10-01), Pajak et al.
patent: 6319026 (2001-11-01), Chen et al.
patent: 6328603 (2001-12-01), Chang
patent: 6347962 (2002-02-01), Kline
patent: 6349465 (2002-02-01), Brownell et al.
patent: 6445201 (2002-09-01), Simizu et al.
patent: 6474999 (2002-11-01), Givens et al.
patent: 6648657 (2003-11-01), Korsunsky et al.
patent: 6685486 (2004-02-01), Zhang et al.
patent: 6703702 (2004-03-01), Inoue et al.
patent: 7018240 (2006-03-01), Bourdykina et al.
patent: 2003/0132520 (2003-07-01), Watanabe et al.
patent: 2003/0159122 (2003-08-01), Iida et al.
Presentation X2Y® Technology for connectors, Phicomp a Yageo Company; http://www.yageo.com/pdf/X2y%20In%20Connectors.Pdf.
Hollington Jermele
Michael & Best & Friedrich LLP
LandOfFree
Packaged circuit module for improved installation and operation does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Packaged circuit module for improved installation and operation, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Packaged circuit module for improved installation and operation will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3688890