Packaged accelerometer

Measuring and testing – Speed – velocity – or acceleration – Structural installation or mounting means

Reexamination Certificate

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Details

C073S514380, C073S514010

Reexamination Certificate

active

06925875

ABSTRACT:
A micro machined accelerometer package includes a chip having a top surface and a bottom surface. A micro machined accelerometer is formed in the chip, the accelerometer including a mass cantilevered from the remainder of the chip to be movable out of the plane of the chip, one or more motion detectors for detecting motion of the mass, processing circuitry and one or more bond pads for communicating detected accelerations. A first hollow molded cap is bonded to the top surface over at least part of the accelerometer to define a first cavity into which the cantilevered mass may move. The first molded cap is bonded to the chip such that the cap covers the mass, the motion detectors and the processing circuitry but leaves the bond pads uncovered.

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patent: 2000277753 (2000-10-01), None
patent: 2001144117 (2001-05-01), None
patent: 411593 (2000-11-01), None

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