Package with stacked substrates

Details Package with stacked substrates Package with stacked substrates

2005-12-06

2005-12-06

Clark, S. V. (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S724000

Reexamination Certificate

active

06972479

ABSTRACT:
A package having a plurality of stacked substrates is provided. The package has at least two substrates. One substrate is stacked over the other to construct a three-dimensional circuit structure. Elements are disposed on the respective substrates. At least a conductive column is disposed between the two substrates. A lead-frame is connected to the substrates or the elements. The lead-frame also has a plurality of leads. The two neighboring substrates are electrically connected through the conductive column so that the average signal transmission length is shortened and the signal transmission quality is improved. Furthermore, the conductive column increases the mechanical strength of the package and reduces the degree of warping in the package so that a longer life span can be expected.

REFERENCES:
patent: 6144571 (2000-11-01), Sasaki et al.
patent: 6163076 (2000-12-01), Lee et al.
patent: 6190944 (2001-02-01), Choi
patent: 6313598 (2001-11-01), Tamba et al.
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patent: 6603197 (2003-08-01), Yoshida et al.
patent: 6710439 (2004-03-01), Lee et al.
patent: 6777787 (2004-08-01), Shibata
patent: 6836009 (2004-12-01), Koon et al.

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