Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1998-01-13
2000-04-11
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361760, 361825, 361826, 361764, 361782, 361783, 361719, 361720, 257668, 257767, 257691, 257723, 257724, 338252, 338272, H05K 702
Patent
active
060494700
ABSTRACT:
A component package includes a case with a bond shelf and a conductive layer formed on the bond shelf. The bond shelf is characterized by an inward edge and an outward edge and at least one reticulation, each reticulation being characterized by an outward edge and an inward edge. The reticulation inward edge is co-linear with the bond shelf inward edge. The conductive layer includes a mounting pad for each reticulation and a serpentine conductor connecting the mounting pads, the mounting pad being disposed between the inward edge of the reticulation and the outward edge of the reticulation. The component package further includes a chip transistor mounted on a first mounting pad and a chip resistor mounted in a first reticulation. A semiconductor circuit mounted in the component package includes a bonding pad connected to a pad on the chip transistor and one end of the chip resistor.
REFERENCES:
patent: 3935446 (1976-01-01), Michon
patent: 4580155 (1986-04-01), Tsoi et al.
patent: 5029190 (1991-07-01), Narabu et al.
patent: 5321299 (1994-06-01), Ohkawa et al.
patent: 5357129 (1994-10-01), Kamimura
patent: 5412538 (1995-05-01), Kikinis et al.
patent: 5449908 (1995-09-01), Wadsworth et al.
patent: 5504370 (1996-04-01), Lin et al.
patent: 5543641 (1996-08-01), Wadsworth et al.
patent: 5598035 (1997-01-01), Rusu et al.
patent: 5600696 (1997-02-01), Sauer
patent: 5602585 (1997-02-01), Dickinson et al.
patent: 5616952 (1997-04-01), Nakano et al.
patent: 5731633 (1998-03-01), Clayton
patent: 5747875 (1998-05-01), Oshima
patent: 5767579 (1998-06-01), Kanazawa et al.
Dalsa Inc.
Foster David
Picard Leo P.
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