Package with integrated thermoelectric module for cooling of int

Details Package with integrated thermoelectric module for cooling of int Package with integrated thermoelectric module for cooling of int

1999-01-04

2000-08-01

Bennett, Henry

Refrigeration

Using electrical or magnetic effect

Thermoelectric; e.g., peltier effect

62 32, 622592, 16510421, F25B 2102

Patent

active

060949198

ABSTRACT:
A package for an integrated circuit (IC) comprises a lid attached to a base, with the IC being disposed in a space or cavity between the lid and the base. A thermoelectric module (TEM) having first and second primary surfaces is incorporated into a section of the lid. The first primary surface is thermally coupled to the IC such that application of power to the TEM causes heat to be transferred away from the IC.

REFERENCES:
patent: 5032897 (1991-07-01), Mansuria et al.
patent: 5220171 (1993-06-01), Hara et al.
patent: 5724818 (1998-03-01), Iwata et al.
patent: 5918469 (1999-07-01), Cardella
patent: 5960866 (1999-10-01), Kimura et al.

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