Package with improved heat transfer structure for semiconductor

Details Package with improved heat transfer structure for semiconductor Package with improved heat transfer structure for semiconductor

1994-11-15

1996-06-18

Thompson, Gregory D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

165 802, 165185, 174 163, 257713, 361715, H05K 720

Patent

active

055284566

ABSTRACT:
The invention provides a package with an improved semiconductor device heat transfer structure including a semiconductor integrated circuit chip mounted on a substrate, a package for receiving the semiconductor integrated circuit chips mounted on the substrate, a radiator being attached to the package for radiation of a heat to an exterior and for sealing the package and a foil which made of a heat conductive material has corrugations having top portions in contact with the chip and bottom portions in contact with the radiator for transferring the heat from the semiconductor integrated circuit chip to the radiator.

REFERENCES:
patent: 2920245 (1960-01-01), Anderson et al.
patent: 3694699 (1972-09-01), Snyder et al.
patent: 4270604 (1981-06-01), Nakamura
patent: 4763225 (1988-08-01), Frenkel et al.
patent: 4926935 (1990-05-01), Haushalter
patent: 5268813 (1993-12-01), Chapman

Affiliated with

Also associated with

Rating

Package with improved heat transfer structure for semiconductor does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Package with improved heat transfer structure for semiconductor , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Package with improved heat transfer structure for semiconductor will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-227673