Package with heat sink

Details Package with heat sink Package with heat sink

1992-09-10

1993-08-31

Thompson, Gregory D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

165 803, 165185, 174 163, 257708, 257722, 361690, H05K 720

Patent

active

052414523

ABSTRACT:
Disclosed is a heat-sink equipped package in which a heat sink has a plurality of flat plates arranged in a row, and both end plates have a rectangular shape, while those plates located between the end plates are each an inverted trapezoid having the bottom side shorter than the top side. This structure of the heat sink allows air to easily flow through the bottom portions of the plates. The cooling air therefore leaks outside less, and passes through the spacings between the plates, increasing the cooling performance of the heat sink and improving the cooling efficiency of the package.

REFERENCES:
patent: 3303392 (1967-02-01), Zelina
patent: 3798506 (1974-03-01), English
patent: 5130918 (1992-07-01), Schuster

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