Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2007-04-24
2007-04-24
Thai, Luan (Department: 2891)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
C438S125000, C257S704000, C257SE23086, C257SE23083
Reexamination Certificate
active
10856371
ABSTRACT:
A method of packaging includes placing a restrainer on a package during processing. The method includes clipping the restrainer in place and then exposing the package to high temperatures. After processing the restrainer is removed. An alternative process attaches a component die to a substrate having a cavity in a first surface. The process may then include dispensing and curing an underfill material in the cavity, and attaching a lid to the first surface of the substrate.
REFERENCES:
patent: 6413353 (2002-07-01), Pompeo et al.
Hasan Altaf
Lee Lisa Yung Hui
Lee Michael Keat Lye
Loke Mun Leong
Ong Soon Chuan
Marger & Johnson & McCollom, P.C.
Thai Luan
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