Package unit, printed board having the same, and electronic...

Details Package unit, printed board having the same, and electronic... Package unit, printed board having the same, and electronic...

2007-05-22

2007-05-22

Datskovsky, Michael (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S704000, C361S707000, C257S712000, C257S713000

Reexamination Certificate

active

11332287

ABSTRACT:
A package unit to be mounted on an external printed board includes a package board mounted with an exoergic circuit element, a heat spreader that transmits heat from the exoergic circuit element to a heat sink that radiates the heat, a joining member that seals between the exoergic circuit element and the heat spreader, and forms a sealing space in cooperation with the exoergic circuit element and the heat spreader, and a liquid metal sealed in the sealing space.

REFERENCES:
patent: 4323914 (1982-04-01), Berndlmaier et al.
patent: 6162663 (2000-12-01), Schoenstein et al.
patent: 6665186 (2003-12-01), Calmidi et al.
patent: 6667560 (2003-12-01), Goh
patent: 60-84848 (1985-05-01), None
patent: 63-185050 (1988-07-01), None
patent: 3-97993 (1991-10-01), None
patent: 5-102354 (1993-04-01), None
patent: 06053374 (1994-02-01), None
Kawai et al., English translation of Japanese Patent 05-102354, Dated Apr. 1993.

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