Package-type semiconductor laser device

Details Package-type semiconductor laser device Package-type semiconductor laser device

1992-10-27

1994-07-05

Bovernick, Rodney B.

Coherent light generators

Particular temperature control

Heat sink

385 92, H01S 304, H01S 3045

Patent

active

053274431

ABSTRACT:
A package-type semiconductor laser device comprises a metallic heat sink plate, a semiconductor laser chip carried by the heat sink plate, and a cap mounted on the heat sink plate to enclose the laser chip. The cap has a transparent window in opposed relation to the heat sink plate. The laser chip has a front facet oriented so that the laser chip emits an output laser beam generally in parallel to the heat sink plate. The laser device further comprises a reflective member arranged in the cap for deflecting the output laser beam toward the window of the cap.

REFERENCES:
patent: 3864019 (1975-02-01), Smolinsky et al.
patent: 3896305 (1975-07-01), Ostrowsky et al.
patent: 3967877 (1976-07-01), Heidrich et al.
patent: 4130343 (1978-12-01), Miller et al.
patent: 4403243 (1983-09-01), Hakamada
patent: 4756590 (1988-07-01), Forrest et al.
patent: 4818053 (1989-04-01), Gordon et al.
patent: 4854659 (1989-08-01), Hamerslag et al.
patent: 5065226 (1991-11-01), Kluitmans et al.
patent: 5089861 (1992-02-01), Tanaka et al.
patent: 5140384 (1992-08-01), Tanaka
patent: 5163113 (1992-11-01), Melman
patent: 5175783 (1992-12-01), Tatoh

Affiliated with

Also associated with

Rating

Package-type semiconductor laser device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Package-type semiconductor laser device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Package-type semiconductor laser device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-802131