Package substrate with dual material build-up layers

Details Package substrate with dual material build-up layers Package substrate with dual material build-up layers

2005-08-10

2009-10-13

Menz, Laura M (Department: 2813)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S737000, C257S759000

Reexamination Certificate

active

07602062

ABSTRACT:
Multi-layered, organic build-up semiconductor package substrates have build-up layers with layers of both fibrous organic dielectric material and non-fibrous organic dielectric material. Non-fibrous dielectric material layers are positioned below the signal metal layers and fibrous dielectric material layers are positioned below the power/ground plane metal layers. The package substrate combines in a single package substrate the advantages of rigidity, strength and relatively low CTE of a fibrous material with the capacity of a non-fibrous material to achieve fine resolution signal metal lines.

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