Package substrate with a cavity, semiconductor package and...

Details Package substrate with a cavity, semiconductor package and... Package substrate with a cavity, semiconductor package and...

2009-03-22

2011-11-01

Nguyen, Khiem (Department: 2839)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C361S749000

Reexamination Certificate

active

08049114

ABSTRACT:
A method of making a package substrate includes providing a cladding sheet comprising a first metal layer, a second metal layer and an intermediate layer between the first and second metal layers; etching away a portion of the first metal layer to expose a portion of the intermediate layer thereby forming a metal island body; laminating a first copper clad on the cladding sheet comprising a first copper foil and a first insulating layer; patterning the first copper foil to form a first circuit trace; patterning the second metal layer to form a second circuit trace; removing the metal island body to form a cavity in the first insulating layer; and removing the intermediate layer from bottom of the cavity.

REFERENCES:
patent: 6625880 (2003-09-01), Nabemoto et al.
patent: 2005/0224988 (2005-10-01), Tuominen
patent: 2007/0131349 (2007-06-01), Tuominen et al.
patent: 2008/0029890 (2008-02-01), Cheng
patent: 2002-185097 (2002-06-01), None

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