Package substrate pattern to accommodate optical waveguide

Details Package substrate pattern to accommodate optical waveguide Package substrate pattern to accommodate optical waveguide

2008-05-06

2008-05-06

Pert, Ivan (Department: 2826)

Optical waveguides

Integrated optical circuit

C385S088000, C257S678000

Reexamination Certificate

active

07369718

ABSTRACT:
An apparatus comprising a substrate comprising a base substrate, a conductive layer on the base substrate, and a solder resist layer on the conductive layer, a die including an optical area, the die being flip-chip bonded to the substrate, and an optical inter-connector optically coupled to the optical area and at least partially positioned between the die and the base substrate, the optical inter-connector positioned in a trench formed in the solder resist layer and the conductive layer. A process comprising providing a substrate comprising a base substrate, a conductive layer on the base substrate, and a solder resist layer on the conductive layer, forming a trench in the conductive layer and the solder resist layer, positioning a waveguide in the trench, and flip-chip bonding a die to the substrate, the die including an optical area, such that the optical area is optically coupled to the waveguide.

REFERENCES:
patent: 5009476 (1991-04-01), Reid et al.
patent: 5764832 (1998-06-01), Tabuchi
patent: 5987202 (1999-11-01), Gruenwald et al.
patent: 6163835 (2000-12-01), Todd et al.
patent: 6343164 (2002-01-01), Robertsson et al.
patent: 6477296 (2002-11-01), Ogawa
patent: 2002/0040983 (2002-04-01), Fitzergald
patent: 2002/0096686 (2002-07-01), Raj et al.
patent: 2002/0131727 (2002-09-01), Reedy et al.
patent: 2003/0103712 (2003-06-01), Giebov et al.
patent: 2004069824 (2004-03-01), None
patent: PCT/US2005/022225 (2005-10-01), None
Mohammed, E. M., et al., “Optical I/O Technology for VLSI”, Intel Corporation.

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