Package substrate manufactured using electrolytic leadless...

Details Package substrate manufactured using electrolytic leadless... Package substrate manufactured using electrolytic leadless...

2007-08-14

2007-08-14

Ha, Nathan W. (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C174S255000

Reexamination Certificate

active

10609499

ABSTRACT:
A package substrate is manufactured by electrolytically plating Au in a semi-additive manner without using any plating lead line. Such a package substrate includes a base substrate with a plurality of through holes, a first copper plated layer on portions of the base substrate and inner surfaces of the through holes, a plated pattern layer on the first copper plated layer, wire bonding pads on the plated pattern layer at an upper surface of the base substrate, the wire bonding pads including Au and not connected to a remnant of a plating lead line, solder ball pads on the plated pattern layer at a lower surface of the base substrate, the solder ball pads including Au and not connected to a remnant of a plating lead line, and a solder resist covering the base substrate and the plated pattern layer.

REFERENCES:
patent: 6208525 (2001-03-01), Imasu et al.
patent: 6249045 (2001-06-01), Kresge et al.
patent: 6407341 (2002-06-01), Anstrom et al.
patent: 6507497 (2003-01-01), Mashino
patent: 6649506 (2003-11-01), Hsu
patent: 6762921 (2004-07-01), Asai et al.
patent: 2003/0011070 (2003-01-01), Iijima et al.
patent: 2004/0048414 (2004-03-01), Heinz et al.
patent: 2004/0099939 (2004-05-01), Alcoe et al.
patent: 2004/0154166 (2004-08-01), Lee et al.
patent: 2004/0201095 (2004-10-01), Palmer et al.
patent: 2005/0067713 (2005-03-01), Mutta et al.
patent: 2005/0218503 (2005-10-01), Abe et al.
patent: 2006/0023439 (2006-02-01), Fraley et al.
patent: 05-347468 (1993-12-01), None
patent: 07-193166 (1995-07-01), None
patent: 10-321750 (1998-12-01), None

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