Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2006-12-19
2006-12-19
Parker, Kenneth (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S700000, C257S678000, C257S778000, C333S133000, C333S193000
Reexamination Certificate
active
07151310
ABSTRACT:
On a piezoelectric substrate23, there are provided surface acoustic wave devices F1and F2in which predetermined circuit patterns are formed, and a package substrate11comprising side vias16formed in a caved manner in the thickness direction on side surfaces on which the surface acoustic wave devices are mounted. When the side vias16are each assumed to have the opening width φ and the maximum depth D, a size satisfying φ/2<D is assumed. Thereby, it is possible to prevent protrusion of a soldering fillet applied on the side via.
REFERENCES:
patent: 4352449 (1982-10-01), Hall et al.
patent: 4551746 (1985-11-01), Gilbert et al.
patent: 4737742 (1988-04-01), Takoshima et al.
patent: 4790894 (1988-12-01), Homma et al.
patent: 5058265 (1991-10-01), Goldfarb
patent: 5459368 (1995-10-01), Onishi et al.
patent: 5561406 (1996-10-01), Ikata et al.
patent: 5691568 (1997-11-01), Chou et al.
patent: 5786738 (1998-07-01), Ikata et al.
patent: 5859473 (1999-01-01), Ikata et al.
patent: 6057600 (2000-05-01), Kitazawa et al.
patent: 6245186 (2001-06-01), Alcoe et al.
patent: 6351194 (2002-02-01), Takahashi et al.
patent: 6356173 (2002-03-01), Nagata et al.
patent: 6388545 (2002-05-01), Kawachi et al.
patent: 6534855 (2003-03-01), Ahn et al.
patent: 6570469 (2003-05-01), Yamada et al.
patent: 0 617 466 (1994-09-01), None
patent: 1 050 906 (2000-11-01), None
patent: 1 076 414 (2001-02-01), None
patent: 11-26623 (1999-01-01), None
patent: 2000049565 (2000-02-01), None
European Search Report dated Apr. 17, 2003.
European Search Report dated Jan. 29, 2003.
Chu Chris C.
Parker Kenneth
TDK Corporation
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