Package substrate for integrated circuit and method of...

Details Package substrate for integrated circuit and method of... Package substrate for integrated circuit and method of...

2006-12-26

2006-12-26

Vigushin, John B. (Department: 2841)

Metal working

Method of mechanical manufacture

Electrical device making

C029S846000, C156S514000, C174S259000, C174S261000

Reexamination Certificate

active

07152313

ABSTRACT:
In some embodiments, an article of manufacture includes a metal layer and a first dielectric layer in contact with a first face of the metal layer. The article of manufacture also includes a second dielectric layer in contact with a second face of the metal layer. The second face of the metal layer is opposite to the first face of the metal layer. The metal layer may be a continuous sheet having slots formed therein to allow the first and second dielectric layers to adhere to each other by way of the slots.

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patent: 6426469 (2002-07-01), Koga et al.
patent: 6496081 (2002-12-01), Govind et al.

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