Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reissue Patent
2004-06-25
2009-12-22
Bui, Hung S (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S760000, C361S777000, C361S764000, C361S784000, C361S780000, C174S265000, C174S264000, C174S262000
Reissue Patent
active
RE041051
ABSTRACT:
According to the package board of the present invention, each soldering pad formed on the top surface of the package board, on which an IC chip is to be mounted, is small (133 to 170 μm in diameter), so the metallic portion occupied by the soldering pads on the surface of the package board is also small. On the other hand, each soldering pad formed on the bottom surface of the package board, on which a mother board, etc. are to be mounted, is large (600 μm in diameter), so the metallic portion occupied by the soldering pads on the surface of the package board is also large. Consequently, a dummy pattern58M is formed between conductor circuits58U and58U for forming signal lines on the IC chip side surface of the package board thereby to increase the metallic portion on the surface and adjust the rate of the metallic portion between the IC chip side and the mother board side of the package board, protecting the package board from warping in the manufacturing processes, as well as during operation.
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Asai Motoo
Mori Yoji
Bui Hung S
IBIDEN Co., Ltd.
Oblon & Spivak, McClelland, Maier & Neustadt P.C.
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