Package structure, printed circuit board mounted with the...

Details Package structure, printed circuit board mounted with the... Package structure, printed circuit board mounted with the...

2008-09-23

2008-09-23

Thompson, Gregory (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C165S080300, C165S185000, C257S719000, C361S710000, C361S719000

Reexamination Certificate

active

10662815

ABSTRACT:
A package structure to be mounted on was external printed circuit board includes a package board that is mounted with an exoergic circuit element, and a heat sink that radiates heat from the exoergic circuit element, wherein first pressure for connecting the heat sink to the package board is separated from second pressure for compressing the package board against the printed circuit board.

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patent: 6282093 (2001-08-01), Goodwin
patent: 6449170 (2002-09-01), Nguyen et al.
patent: 6459582 (2002-10-01), Ali et al.
patent: 6545879 (2003-04-01), Goodwin
patent: 2002/0030972 (2002-03-01), Ali et al.
patent: 0 637 079 (1995-02-01), None
patent: 1031233 (1964-06-01), None
patent: 11-135217 (1999-05-01), None
patent: 11-284097 (1999-10-01), None
patent: 2001-281295 (2001-10-01), None

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