Package structure of pressure sensor

Details Package structure of pressure sensor Package structure of pressure sensor

2007-10-11

2008-12-30

Allen, Andre J (Department: 2855)

Measuring and testing

Fluid pressure gauge

Diaphragm

C073S724000, C438S050000

Reexamination Certificate

active

07469590

ABSTRACT:
A pressure-sensor package mainly includes a pressure sensor, a support substrate, and a resin layer. The pressure sensor includes a glass substrate having a fixed electrode, and a silicon substrate having a diaphragm that is disposed apart from the fixed electrode by a predetermined distance. The support substrate is a silicon/glass composite substrate on which the pressure sensor is mounted such that the support substrate and the diaphragm face each other. The resin layer fixes the pressure sensor and the support substrate together. The pressure sensor is mounted on a mounting area of the support substrate with a joint member therebetween. Accordingly, even if a gap between the support substrate and the diaphragm has a size of about several micrometers, the pressure-sensor package is capable of performing pressure detection with high sensitivity.

REFERENCES:
patent: 2003/0056598 (2003-03-01), Kimura et al.
patent: 2006/0001128 (2006-01-01), Tamura et al.
patent: 2007/0095147 (2007-05-01), Kikuiri et al.
patent: 2007/0205474 (2007-09-01), Fukuda et al.
patent: 2007/0264742 (2007-11-01), Tamura et al.
patent: 09-101220 (1997-04-01), None

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