Package structure of organic electroluminescence panel

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – In combination with or also constituting light responsive...

Reexamination Certificate

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Details

C257S081000, C257S072000, C257S088000, C257S099000

Reexamination Certificate

active

06858874

ABSTRACT:
A package structure of an OEL panel includes a printed circuit board, at least one OEL panel, and several bumps. Wherein, the OEL panel has several poly solder interconnections arranged in an array structure. The printed circuit board has several solder pads, which are also implemented with bumps. The at least one OEL panel is disposed on the printed circuit board to have the electric connection with the printed circuit board through the poly solder interconnections and the bumps.

REFERENCES:
patent: 5693170 (1997-12-01), Li
patent: 5747363 (1998-05-01), Wei et al.
patent: 6677620 (2004-01-01), Ishii et al.

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