Package structure of light emitting diode

Details Package structure of light emitting diode Package structure of light emitting diode

2005-04-19

2005-04-19

Tran, Thien F (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Incoherent light emitter structure

In combination with or also constituting light responsive...

C257S082000, C257S084000, C257S098000, C257S099000, C257S100000

Reexamination Certificate

active

06881980

ABSTRACT:
The present invention relates to a package structure for a light emitting diode (LED). The LED package structure of this invention includes a package housing having at least a trench and at least two leads. The package structure includes at least a die or an LED chip disposed on the bottom surface of the trench, while two electrodes of the die are respectively electrically connected to the ends of two leads on the bottom surface of the trench. A transparent plate of glass or crystal materials is mounted and connected to the housing by anodic bonding or glue bonding, to seal the trench, while the other ends of leads are exposed on the surface of the housing without being covered by the transparent plate.

REFERENCES:
patent: 5907151 (1999-05-01), Gramann et al.

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