Package structure of integrated circuit device and...

Details Package structure of integrated circuit device and... Package structure of integrated circuit device and...

2011-01-04

2011-01-04

Potter, Roy K (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257S666000, C257SE23147, C438S108000, C438S124000

Reexamination Certificate

active

07863717

ABSTRACT:
A package structure of an integrated circuit device comprises a copper foil substrate, an integrated circuit device, a plurality of metal wires and an encapsulation material. The copper foil substrate comprises an IC bonding area, a plurality of conductive areas and an insulating dielectric material. The integrated circuit device is mounted on the surface of the IC bonding area, and is electrically connected to the plurality of conductive areas through the metal wires. The insulating dielectric material is between the IC bonding area and the conductive areas, and is also between two adjacent conductive areas. In addition, the encapsulation material covers the IC bonding area, the conductive areas and the integrated circuit device.

REFERENCES:
patent: 2009/0206358 (2009-08-01), Chen et al.

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