Package structure of a multi-chip module

Details Package structure of a multi-chip module Package structure of a multi-chip module

1998-05-15

2000-01-11

Sparks, Donald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361707, 361710, 361720, 257717, 29832, 174252, 165 803, H05K 720

Patent

active

060143142

ABSTRACT:
A semiconductor package structure comprising the following elements. A printed board has a first surface on which a plurality of first heat-conductive patterns are provided and a second surface on which a plurality of second heat-conductive patterns are provided. The printed board has heat-conductive through holes connecting the first and second heat-conductive patterns. A multi-chip module has a plurality of semiconductor packages and is provided on the first surface of the printed board. A plurality of heat-conductive supporting members are provided on the first heat-conductive patterns. A heat radiator structure is provided which has at least two heat radiation fins and at least a heat radiation groove defined by the heat radiation fins. The heat radiator structure is provided on the multi-chip module. A plurality of heat conductivity plate-shaped members are fixed to the heat-conductive supporting members and inserted into the heat radiation groove so that the heat conductivity plate-shaped members are in contact with upper surfaces of the heat radiation fins. A first heat transfer route is formed for transferring a heat generated in the multi-chip module through the heat radiator structure to atmosphere surrounding the heat radiator structure. A second heat transfer route is formed for transferring the heat through the heat radiator structure, the heat conductivity plate-shaped members, the heat-conductive supporting members and the first heat-conductive patterns to the printed board and also to the through holes which are heat-conductive to the second heat-conductive patterns. A third heat transfer route is formed for transferring the heat to the printed board.

REFERENCES:
patent: 5089936 (1992-02-01), Kojima et al.
patent: 5375039 (1994-12-01), Wiesa

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