Package structure of a composite LED

Electric lamp and discharge devices – With luminescent solid or liquid material – Solid-state type

Reexamination Certificate

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C257S678000, C438S107000

Reexamination Certificate

active

06909234

ABSTRACT:
A package structure of a composite LED is to package an LED chip into a SMD LED package subbody component. Then, a single SMD LED package subbody component or multiple SMD LED package subbody components may be packaged into a large sized recessed package mother body, thereby forming the package structure of a composite LED. Thus, the quality is better, and the color shift is less, thereby enhancing the quality of production, and thereby decreasing the cost of production. In addition, the SMD LED may be previously classified according to the features, and may then be packaged into the mother body, thereby obtaining better features, such as Vf, color, brightness or the like.

REFERENCES:
patent: 5998232 (1999-12-01), Maruska
patent: 5998925 (1999-12-01), Shimizu et al.
patent: 6310364 (2001-10-01), Uemura
patent: 6396082 (2002-05-01), Fukasawa et al.
patent: 6653661 (2003-11-01), Okazaki
patent: 6667190 (2003-12-01), Kung et al.
patent: 6686609 (2004-02-01), Sung

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