Package structure module of bump posited type lead frame

Details Package structure module of bump posited type lead frame Package structure module of bump posited type lead frame

2007-02-27

2007-02-27

Potter, Roy Karl (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S737000

Reexamination Certificate

active

10968187

ABSTRACT:
A package structure that uses a bump posited type lead frame is disclosed. The package structure uses a lead frame having holes thereon for accommodating conductive bumps of a chip or a positioning film having openings thereon for accommodating conductive bumps of a chip or both to avoid the flow and deformation of the conductive bumps during bonding so as to prevent the electrical property of the package structure from degradation and increase the reliability of the chip package.

REFERENCES:
patent: 5849608 (1998-12-01), Abe
patent: 6388336 (2002-05-01), Venkateshwaran et al.

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