Package structure in which coreless substrate has direct...

Details Package structure in which coreless substrate has direct... Package structure in which coreless substrate has direct...

2008-03-19

2011-11-15

Wilczewski, May (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S758000, C257SE23020, C257SE23023

Reexamination Certificate

active

08058723

ABSTRACT:
A package structure in which a coreless substrate has direct electrical connections to a semiconductor chip and a manufacturing method thereof are disclosed. The method includes the following steps: providing a metal carrier board having a cavity; placing a chip having a plurality of electrode pads on an active surface in the cavity of a board; filling the cavity with an adhesive for fixing the chip; forming a solder mask on the active surface of the chip and the surface of the metal carrier board at the same side, wherein the solder mask has a plurality of openings to expose the electrode pads of the chip; forming a built-up structure on the solder mask and the exposed active surface of the chip in the openings; and removing the metal carrier board. In this method the metal carrier board can support the built-up structure to thereby avoid warpage.

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