Package structure for wireless communication module

Details Package structure for wireless communication module Package structure for wireless communication module

2009-09-30

2011-10-18

Dang, Trung Q (Department: 2892)

Active solid-state devices (e.g., transistors, solid-state diode

With shielding

C257SE23114

Reexamination Certificate

active

08039930

ABSTRACT:
A package structure for a wireless communication module is disclosed and includes: a substrate having an upper surface defining a supporting region, an annular ground pad surrounding the supporting region, and at least one auxiliary ground pad formed in the supporting region; at least one chip mounted on the supporting region and electrically connected to the substrate; and a shielding lid having a receiving space for receiving the chip, a ground end surface electrically connected to the annular ground pad of the substrate, and at least one auxiliary ground portion electrically connected to the auxiliary ground pad for forming at least one auxiliary ground pathway to adjust the characteristic of the enhanced peak generated by the cavity-resonance effect of the shielding lid. Thus, the enhanced peak can be shifted out of a regulated frequency range of the EMI shielding test, so that the yield thereof can be increased.

REFERENCES:
patent: 7629674 (2009-12-01), Foster
patent: 7772046 (2010-08-01), Pagaila et al.
patent: 7799602 (2010-09-01), Pagaila et al.
patent: 2009/0302435 (2009-12-01), Pagaila et al.

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